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  学术报告通知:Antenna-in-Package (AiP) Technology:From Academic Curiosity to Industrial Reality  

演讲题目: Antenna-in-Package (AiP) Technology:From Academic Curiosity to Industrial Reality

演讲者: Y. P. Zhang, FIEEE,(IEEE AP-S DL

        Nanyang Technological University, Singapore

时间: 2019年 3月7号 (星期四)上午10点-11点       

地点: 南京市江宁区秣周东路9号,无线谷A3楼4层3412会议室

主办单位:东南大学信息科学与工程学院 毫米波国家重点实验室

             IEEE AP-MTT-EMC Joint Nanjing Chapter


Abstract Antenna-in-Package (AiP) technology is an antenna solution technology that realizes an antenna or antennas in or on an integrated circuit package that can carry a radio or radar die or dies to be mounted on a system printed circuit board (PCB). AiP technology has been widely recognized as the mainstream antenna and packaging technology for millimeter-wave applications such as 60-GHz radio and gesture radar, 79-GHz automotive radar, and 28-GHz new radio.  In this talk, I shall first introduce how AiP technology has been developed as we know today. Then, I shall discuss four aspects of AiP technology including design, fabrication, testing, and applications. Next, I shall give an AiP example designed at 60 GHz in low temperature co-fired ceramic process. Finally, I shall draw the conclusion and identify future direction to further advance AiP technology.

Biography: Y. P. Zhang is a full Professor of Electronic Engineering with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S), and a Fellow of IEEE.

Prof. Zhang was a Member of the Field Award Committee of the IEEE AP-S (2015-2017), an Associate Editor of the IEEE Transactions on Antennas and Propagation (2010-2016), and the Chair of the IEEE Singapore MTT/AP joint Chapter (2012). Prof. Zhang was selected by the Recruitment Program of Global Experts of China as a Qianren Scholar at Shanghai Jiao Tong University (2012). He was awarded a William Mong Visiting Fellowship (2005) and appointed as a Visiting Professor (2014) by the University of Hong Kong.

Prof. Zhang has published numerous papers, including two invited papers in the Proceedings of the IEEE and one invited paper in the IEEE Transactions on Antennas and Propagation. He holds 7 US patents. He received the Best Paper Award from the 2nd IEEE/IET International Symposium on Communication Systems, Networks and Digital Signal Processing, July 18–20, 2000, Bournemouth, U.K., the Best Paper Prize from the 3rd IEEE International Workshop on Antenna Technology, March 21–23, 2007, Cambridge, U.K., and the Best Paper Award from the 10th IEEE Global Symposium on Millimeter-Waves, May 24–26, 2017, Hong Kong, China. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012.

Prof. Zhang has made pioneering and significant contributions to the development of the antenna-in-package (AiP) technology that has been widely adopted by chipmakers for millimeter-wave applications. His current research interests include the development of antenna-on-chip (AoC) technology and characterization of chip-scale propagation channels at terahertz for wireless chip area network (WCAN).

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