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  学术报告会通知:3D-Printed mm-Wave Devices and Circuits for System-in-a-Package Applications  
 

演讲题目: 3D-Printed mm-Wave Devices and Circuits for System-in-a-Package Applications

报告人: Prof. Jing Wang, Professor and Director, Center for Wireless and Microwave Information Systems (WAMI), Department of Electrical Engineering, University of South Florida, United States 

时间2019年5月9日 (星期四)上午10:00

地点南京市江宁开发区,秣周东路9号,无线谷 A3楼4层3412会议室

主办单位:东南大学毫米波国家重点实验室

                     IEEE AP-MTT-EMC Joint Nanjing Chapter

                  江苏省电子学会天线与微波专委会

Abstract: This invited talk will present our recent research towards strategic design, additive manufacturing (AM also known as 3D printing), and characterization of devices, interconnects and circuits for the emerging mm-Wave and sub-THz system-in-a-package (SiP) applications. This talk begins with a brief overview of our research activities for development of a diverse library of well-characterized functional materials suited for additive manufacturing of mm-W devices, interconnection and packaging of integrated circuits (MMIC’s). The newly developed feedstock composites exhibit promising EM properties) well suited for applications ranging from RF to mmW frequencies (with tested properties up to 110 GHz). The 3D printed transmission lines and probe pads can be re-rendered to reach µm scale accuracy by laser trimming to facilitate on-package probe testing. The frequency response of a custom-designed distributed amplifier with a fully 3D printed chip assembly have been characterized between 1 GHz and 30 GHz, which exhibit superb wideband performance than an identical QFN-packaged amplifier. On-package probe measurements of a 3D printed microstrip line has exhibited low insertion losses of 0.028 dB/mm at 5 GHz and 0.187dB/mm at 20 GHz, while CPW lines show an insertion loss lower than 0.34 dB/mm at 110 GHz. This talk also presents a comprehensive study of the design of a multilayer dielectric rod waveguide (DRW), which is comprised of a high permittivity core encased by a low permittivity cladding. The insertion loss of the multi-layer DRW is less than 0.012 dB/mm at Ku-band frequencies and as low as 0.4 dB/mm at WR6 band (110-170 GHz). A dielectric rod antenna (DRA) is also designed and demonstrated to raise the peak gain by 3-9 dB at 30-40 GHz.

Biography: Dr. Jing Wang is a Professor and the Director of Center for Wireless and Microwave Information Systems (WAMI) in Department of Electrical Engineering at the University of South Florida, which he joined since 2006. He got dual B.S. degrees in Electrical Engineering and Mechanical Engineering from Tsinghua University in 1999. He received two M.S. degrees, one in electrical engineering, the other in mechanical engineering, and a Ph.D. degree from University of Michigan in 2000, 2002, 2006, respectively. His research interests include RF/microwave/mmW devices, advanced additive manufacturing, micromachined transducers, RF/Bio-MEMS, lab-on-a-chip and microfluidics, functional nanomaterials. His work has been funded for more than $12M by research grants from federal agencies and contracts from more than a dozen companies. He has published more than 140 peer-reviewed papers and held 11 US patents. He serves as the chairperson for IEEE MTT/AP/EDS Florida West Coast Section and he has been elected as a member of the IEEE MTT-Technical Coordinating Committee on RF Acoustics. He has chaired IEEE Wireless and Microwave Technology Conference (WAMICON) between 2011 and 2014. It is worthwhile mentioning that WAMICON is an IEEE MTT-s sponsored international annual conference, which has been organized by USF WAMI Center in the last 20 years. In 2014, Dr. Wang has served as the general chair of the WAMICON 2014, which was jointly held with International Microwave Symposium (IMS 2014) in Tampa, Florida.   

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