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题    目:    Modeling of Interconnects on Multilayer Lossy Silicon Structures

           with Thin-metallic Ground


报告人:    宋继明  教授 (Iowa State University, USA)

时    间:     2009年5月22日 (五) 下午 15:00-16:30

地    点:    东南大学 (四牌楼校区) 李文正楼 六楼 614 会议室

主    办:    IEEE AP-MTT-EMC Joint Nanjing Chapter




Abstract:  First, an overview of the research has been done in speaker’s group at Iowa State University in last few years is introduced. Then the results on microstrip lines having a ground metal thickness less than the skin depth is discussed, and the impact of the layers below the thin ground is shown. Finally, the spectral domain approach to analyze interconnects over lossy silicon with thin metal ground is presented. Numerical results show that, when the inside metal ground is very thin, electromagnetic field can penetrate it and interact with layers underneath. The microstrip lines with the thin metal ground in both lossy and lossless substrates excite a slow wave.


The Speaker:  Jiming Song received his Ph.D. degree in electrical engineering from Michigan State University in 1993.

     From 1993 to 2000, Dr. Song worked as a postdoctoral research associate, research scientist, senior research scientist, and visiting assistant professor at the University of Illinois at Urbana-Champaign.

     He. was the principal author of the Fast Illinois Solver Code (FISC), which had been distributed to more than 400 government and industrial users by 2000.

     From 1996 to 2000, he also worked as a part-time research scientist at SAIC-DEMACO. From 2000 to 2002, he was a principal staff engineer/scientist at Semiconductor Research Lab. of Motorola in Tempe , Arizona . He is currently an associate professor at Iowa State University.

     Dr. Song has co-edited 1 book, and authored or co-authored 7 book chapters, 40 journal papers, and 110 conference papers. He was selected as an Air Force Office of Scientific Research (AFOSR) Summer Faculty Fellow in 2004 and 2005. Dr. Song was awarded the NSF CAREER grant in 2006.

     Email:       jisong@iastate.edu

     Web site:  http://www.eng.iastate.edu/~jisong

     Address:   Electrical and Computer Engineering

                      Iowa State University

                      Ames , Iowa, USA

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