IEEE China Chapter技术讲座 南京东南大学毫米波国家重点实验室 时间:星期一,2008年9月22日上午9:00~11:00 地点:东南大学李文正楼614北会议室 联系人:东南大学陈继新教授(13912978845) 盛泰南京公司孙建平博士(13357805718)
Product Design and Application Solutions of High Performance Microwave Connectors 高性能微波毫米波连接器的应用 David Shaff 美国西南微波公司微波产品分部总经理
报告内容: 1 Industry background, from Omni-Spectra to today 2 How are "performance" differences obtained? Microwave Launches (Transmission Line Design) The "Taper Effect" in Contact Design Epoxy Contact Retention and RF Leakage Problems Field Serviceable (Field Replaceable) versus Extended Pin Designs Power Handling and New Higher Temperature Requirements for Lead-Free Soldering Housing Design and Grounding 3 How Performance Reduces You Cost Launches to Microstrip / Stripline / End Launch Connectors 4 Field Replaceable Connectors for Cable Assemblies 5 Hi-Rel and Space (Inadequacies of Standards) 6 Accessories Pins and Dielectrics Hermetic seals (including tools form installation) 7 Problems and Solutions Intermateability: SMA vs. 3.5mm vs. 2.92mm, and 2.40mm vs. 1.85mm Improper Installation (Connectors and Hermetic Seals) Installation Tools Hermetic Sealing for Connectors 讲座人简介: David Shaff先生在美国乔治亚工学院获工程学士,在威斯康星大学读研究生,获诺瓦东南大学国际企管硕士。在美国航空电子工业从事多年设计工作,担任过ITT公司的产品设计部经理,部件分部总经理, NEC公司日本航空工业电子分部运作主任,SV微波公司市场销售部主任,SEMFLEX电缆组件公司销售经理。目前他担任西南微波公司微波产品分部总经理。David Shaff为IEEE会员,多次担任美国和国际连接器专业学会和技术委员会的成员和主席,发表电子互连和泸波器技术论文8篇,为美国连接器工业知名人士。 |
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